• Tablet PC Notebook Laptop Mobile Phone BGA Chipset Rework Station
  • Tablet PC Notebook Laptop Mobile Phone BGA Chipset Rework Station
  • Tablet PC Notebook Laptop Mobile Phone BGA Chipset Rework Station
  • Tablet PC Notebook Laptop Mobile Phone BGA Chipset Rework Station
  • Tablet PC Notebook Laptop Mobile Phone BGA Chipset Rework Station
  • Tablet PC Notebook Laptop Mobile Phone BGA Chipset Rework Station

Tablet PC Notebook Laptop Mobile Phone BGA Chipset Rework Station

Type: BGA Rework Station
Structure: Platform
Voltage: 110V/220V
Condition: New
N.W.: 16kg
Power: 2300W
Samples:
US$ 1950/Piece 1 Piece(Min.Order)
| Request Sample
Customization:
Gold Member Since 2015

Suppliers with verified business licenses

Manufacturer/Factory, Trading Company

Basic Info.

Model NO.
DH200
Transport Package
Wooden Package
Specification
L540*W310*H500mm
Trademark
OEM
Origin
Shenzhen, China
HS Code
8515809090
Production Capacity
500 Units / Month

Product Description

Tablet PC Notebook Laptop Mobile Phone BGA Chipset Rework Station

Tablet PC Notebook Laptop Mobile Phone BGA Chipset Rework Station
Tablet PC Notebook Laptop Mobile Phone BGA Chipset Rework Station
Tablet PC Notebook Laptop Mobile Phone BGA Chipset Rework Station
Tablet PC Notebook Laptop Mobile Phone BGA Chipset Rework Station
Tablet PC Notebook Laptop Mobile Phone BGA Chipset Rework Station

DH-200 bga rework station  power 2300W
mobile repairing machine
mobile phone BGA chipset rework station
tablet pc chipset rework station
laptop notebook BGA chipset repairing system
smart phone chipset BGA repair soldering system
BGA repair soldering machine
BGA chipset welding machine

Specification:
 
Total Power 2300W
Top hot air heater 450W
Bottom diode heater 1800W
Power AC220V±10%     50Hz
Lighting Taiwan led working light, any angle adjusted.
Operation mode High definition touch screen, intelligent conversational interface, digital system setting
Storage 5000 groups
Top heater movement Automatic up / down with button,  manual Right/left,
Bottom diode heating Manual right / left movement.
Positioning Intelligent positioning, PCB can be adjusted in X, Y direction with "5 points support" + V-groov pcb bracket + universal fixtures.
Temperature control K sensor, close loop
Temp accuracy ±2ºC
PCB size Max 170×220 mm Min 22×22 mm
BGA chip 2x2 mm - 80x80 mm
Minimum chip spacing 0.15mm
External temper sensor 1pc
Dimensions L540*W310*H500mm
Net weight 16KG


Features:

1. DH-200 special for mobile repairing, such as Samsung, iPhone, Huawei, HTC....  Mini type, lower shipping cost.

2. Top hot air heating, bottom German diode heating zone with glass guard. Top head can move up / down automatic with button. Bottom zone can move frontward / backward. Machine movement with slides, stable and durable.

3. Embedded industrial PC, HD touch screen conversational interface, human-machine interface operation, multi-functional integrated control, human structure design, optional numbers storage, apply temperature curve freely. With multi-functions: "keep same temperature", "instant curve analysis" and "voice warning before heating finish". Real-time actual temperature and temperature curve setting can also be used to analyze and correct the curve if necessary.

4. high precise k-type thermocouple closed-loop control, with temperature module and intelligent control unit to enable precise temperature deviation on ±2ºC. Meanwhile, external temperature measurement connector enables temperature diction and accurate analysis of real time temperature curve.

5. V-groove PCB works for rapid, convenient and accurate positioning, which can suitable for all kinds of PCB board positioning.

6. Movable universal fixture prevent pcb from damaged on fringe component, suitable for all kinds of pcb repairing.

7. With different size of magnet nozzles, easy replace and install, rotate freely 360°, any size can be custom if need. Titanium alloy material, never deformation, never rusty

8. Two heating zones can independently heat and they are multiple temperature control, which can ensure best integration of different temperature areas. Heating temperature, time, slope and cooling can all be set in touch screen conversational interface. Meanwhile PID calculation to control heating process more accurate and more stable.

9.  6-8 segments temperature can be set for top heating and lower heating(up to 16 segments). 50,000 groups of temperature curves can be stored, which can number, modification and apply at any time according to different BGA. Curve analysis, setting and adjustment are also available on touch screen.

10. With Voice warning 5-10 seconds before heating finish: remind operator to pick up bga chip on time. After heating, cooling fan will work automatic, when temperature cool down to room temperature  ( <45ºC ), cooling system will stop automatic to prevent the heater from aging.

11.  CE certification approval. Double protection: Overheating guard + emergency stop function.

 

Send your message to this supplier

*From:
*To:
*Message:

Enter between 20 to 4,000 characters.

This is not what you are looking for? Post a Sourcing Request Now

You Might Also Like

Gold Member Since 2015

Suppliers with verified business licenses

Manufacturer/Factory, Trading Company
Type of Ownership
Limited Company
Export Year
2011-09-01