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BGA repair soldering machine
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DHG600 Optical alignment Manual BGA Rework station
Suitable for all kinds of BGA repairing (CCGA,BGA,QFN, CSP,LGA,Micro SMD,MLF...)
Lead and Lead-free
Specification:
| Total Power |
5300W |
| Top heater |
1200W |
| Bottom heater |
2nd 1200W, 3rd IR heater 2700W |
| Power |
AC220V±10% 50Hz |
| Top hot air speed |
Can be adjusted with adjusting knob |
| Operation mode |
Manual operate, HD touch screen, intelligent man-machine, digital system setting |
| Optical CCD camera lens |
Frontward / backward |
| Bga positioning |
Laser positioning, fast and accurate position of pcb and bga. |
| Camera magnification |
10x - 220x |
| Workbench fine-tuning: |
±15mm forward/backward, ±15mm right/left |
| Placement accuracy: |
±0.01mm |
| Lighting |
Taiwan led working light, any angle adjustable |
| Temperature profile storage |
50000 groups |
| Positioning |
Intelligent positioning, PCB can be adjusted in X, Y direction with "5 points support" + V-groov pcb bracket + universal fixtures. |
| Temperature control |
K sensor, close loop |
| Temp accuracy |
±1ºC |
| PCB size |
Max 390×400 mm Min 22×22 mm |
| BGA chip |
2x2 - 80x80 mm |
| Minimum chip spacing |
0.15mm |
| External temper sensor |
1pc |
| Dimensions |
L610×W570×H750 mm |
| Net weight |
60KG |
Feature:
Humanized design:
- Embedded with Industrial PC + Intelligent temperature module, Stable and reliable.
- Windows OS interface in English and Chinese + USB interface, easy operate.
- With 5 different size of nozzles: upper: 31*31mm, 38*38mm,41*41mm. Bottom: 34*34mm 55*55mm
- Any size of nozzle can be custom, Titanium alloy material, never deformation, never rusty.
- Adopt three heating zone, upper heater and lower heater are hot air, bottom is infrared preheat zone.
- High power cross flow fan, fast cooling the pcb, prevent it from deformation.
Accurate temperature control:
- Three independent temperature heating + PID self setting adjusted + PLC control to ensure temperature accuracy will be on ±1°C
- It can set 8 segments heating, and massive storage of groups temperature profile.
- Setting BGA heating curve conveniently and index search.
- Automatic temperature curve analysis.
Convenient visual alignment:
- Optical alignment system + CCD color lens system
- 2 color separation, magnification, micro adjustment
- Auto focus, auto correction, auto color differentiation.
- Light brightness adjustment system.
- Japan Panasonic camera can move frontward and backward.
- Built-in vacuum sucker, pick up the bga chip conveniently after desoldering.
Precision components:
- Precise fine-tuning knob of bge chip, adjust angle of bga chip to alignment.
- X, Y , Z micrometers fine-tuning, Placement accuracy will be ±0.01 MM.
- V-groove clamp + universal fixture suitable for all kinds of PCB.
- Hot air nozzle with magnet, rotate in any angle, easy replace and operate.
- Heating system and placement head 2 in 1 design, precise positioning.
- Top air speed adjustable function, prevent tiny bga from movement when heating.
Perfect security design:
- With fan failure protection, thermocouple failure protection function.
- Overheating protection, emergency stop function.
- Start up password and modify protection.
Application:
Suitable for all kinds of BGA repairing (CCGA,BGA,QFN, CSP,LGA,Micro SMD,MLF...)
Lead and Lead-free
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